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03.07.2025 07:30:03

AIXTRON participates in research project for increasing energy efficiency in the deposition of SiC layers


EQS-Media / 03.07.2025 / 07:30 CET/CEST

AIXTRON participates in research project for increasing energy efficiency in the deposition of SiC layers

 

Herzogenrath, July 3rd, 2025 – AIXTRON SE (FSE: AIXA) Fraunhofer IISB in Erlangen and bimanu Cloud Solutions GmbH in Neuss will jointly improve energy efficiency in the production of semiconductor layers based on silicon carbide (SiC). To this end, the partners are cooperating in the project “Increasing Energy Efficiency in SiC Epitaxy,” which is funded by the German Federal Ministry of Education and Research (BMBF) and led by AIXTRON.

 

The aim of the €28.4 million project is to increase resource efficiency (water and energy consumption, waste volume) in the production of layer structures made from SiC compound semiconductors. AI-based methods are being researched and developed for both material- and energy-efficient manufacturing processes and products. The potential here is huge: the aim is to halve the electrical energy required per unit area in the manufacture of SiC semiconductors.

 

“Semiconductors based on SiC offer significantly better energy efficiency than conventional silicon, for example in electromobility or renewable energies. However, the production of semiconductors is fundamentally energy-intensive. We therefore see a particularly significant opportunity here to make the production of these forward-looking technologies even more efficient and thus promote their widespread use and the green transformation,” says Prof. Dr. Michael Heuken, VP Advanced Technologies, explaining the significance of the project. 

 

Based on the project work, production processes are to be improved and recommendations for action researched. This is precisely where bimanu's expertise will come into play. The software provider specializes in data integration and analysis in the areas of business intelligence, marketing analytics, Industry 4.0, and energy management.  

 

Fraunhofer IISB is contributing its unique expertise in SiC, both in research and development in this material class and in the further development of processes. Fraunhofer IISB operates the only continuous 150 mm SiC development line in Germany, which is number one in Europe and among the top five in the world. 

 

AIXTRON's focus within the project will be on researching tooltechnology and thus advancing tool development. To this end, several test systems will be set up and operated. The simulation models will be verified on these tools, while the data and models will be developed and tested in cooparation with bimanu. 

 

Contact

Christian Ludwig

Vice President Investor Relations & Corporate Communications

fon +49 (2407) 9030-444

e-mail c.ludwig@aixtron.com

 

 

About AIXTRON:

AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States, and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications.

Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level SolutionS®, Close Coupled Showerhead®, CRIUS®, Gas Foil Rotation®, OVPD®, Planetary Reactor®, PVPD®, TriJet®

For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com.

 

Forward-Looking Statements

This document may contain forward-looking statements regarding the business, results of operations, financial condition, and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance, or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semiconductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law. 

This document is also available in a German language translation version. In case of discrepancies, the English language document shall prevail and shall be the valid version.



End of Media Release


Issuer: AIXTRON SE
Key word(s): Research/Technology

03.07.2025 CET/CEST Dissemination of a Press Release, transmitted by EQS News - a service of EQS Group.
The issuer is solely responsible for the content of this announcement.

The EQS Distribution Services include Regulatory Announcements, Financial/Corporate News and Press Releases.
Archive at www.eqs-news.com


Language: English
Company: AIXTRON SE
Dornkaulstraße 2
52134 Herzogenrath
Germany
Phone: +49 (2407) 9030-0
Fax: +49 (2407) 9030-445
E-mail: invest@aixtron.com
Internet: www.aixtron.com
ISIN: DE000A0WMPJ6
WKN: A0WMPJ
Indices: MDAX, TecDAX
Listed: Regulated Market in Frankfurt (Prime Standard); Regulated Unofficial Market in Berlin, Dusseldorf, Hamburg, Hanover, Munich, Stuttgart, Tradegate Exchange; Nasdaq OTC
EQS News ID: 2164140

 
End of News EQS Media

2164140  03.07.2025 CET/CEST

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